LOW DIELECTRIC INORGANIC COMPOSITION FOR MULTILAYER CERAMIC PACKAGE

摘要

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2. The composition is formed from a mixture of finely divided particles of 25-50 vol.% borosilicate glass and 50-75 vol.% high silica glass. The borosilicate glass comprises approximately 20-35 wt.% B2O3 and approximately 60-80 wt.% SiO2. The high silica glass contains essentially 0.5-1 wt.% alumina, 1-5 wt.% B2O3 and approximately 95-98 wt.% SiO2. The composition can be fired at a temperature of less than 1000.degree.C.