| 摘要 |
PURPOSE:To make it possible to determine good or bad of the soldered amount precisely by obtaining the cross-sectional area of soldering at a preset height position, and comparing the obtained cross-sectional area with the good soldered cross-sectional area. CONSTITUTION:In a three-dimensional image detecting device 1, the height of the lead-soldered part of the part having leads which is mounted and soldered on a printed wiring board is measured. The printed wiring board is moved with a moving mechanism 2, and the measuring parts are changed. Thus, the three-dimensional data are obtained. The three-dimensional data are stored in an image memory 3. In an image processing part 4, the soldered cross-sectional area is obtained at the preset height position. The obtained cross-sectional area is compared with the good soldered cross-sectional area stored in the memory 3, and the good or bad of the soldered amount is determined. |
