| 摘要 |
PURPOSE:To improve measuring accuracy by performing signal processing for removing higher-order components with respect to the output signal of a height measuring instrument, analyzing the computed height data curve, using the result, and performing the mounting inspection. CONSTITUTION:In an image processing part 1, the image signal from an image sensing camera is processed, and the inspected results such as the presence or absence of mounted parts and the quality of soldering are outputted. In a system control part 2, the operation control of mechanism systems such as a reference transfer part and an X-Y table and the control of image data processing based on the send and receive of the signals with the processing part 1 and a height operating circuit 3 are performed. In the circuit 3, the height is operated based on the operation control data from the control part 2 and the measured height data from an operation control circuit 4. In the circuit 4, the movement of the X-Y table and the measuring timing of a measuring instrument are controlled so that the height of the surface of a substrate to be measured is measured in the lattice shape of a specified pitch. The higher-order component is removed with respect to the output signal of the height measuring instrument. The height is obtained by analyzing the computed height-data curve. The mounting inspection is performed by using the height obtained in this way. |
