| 摘要 |
PURPOSE:To enhance a joint between a lead and an electrode for higher reliability by a method wherein a lead presser which presses the lead of an electronic component against the electrode is formed of material which transmits a laser beam. CONSTITUTION:A mounting head 7 is made to descend, and an IC component 1 is mounted on a board 3. Furthermore, the mounting head 7 is made to descend and stop when lead pressers 13 are made to recede into recessed grooves 12 of the mounting head 7 by a prescribed distance resisting the energizing force of a compressed coil spring 18, and leads 1a of the IC component 1 are pressed against electrode 3a of the board 3. Then, a laser beam radiation means 37 enables a laser beam to impinge vertically on a laser beam incidence plane 13a of the lead presser 13, the laser beam is applied to the lead 1a in contact with the lead pressing plane 13b to fuse a joining metal layer 41 by heating to join the lead 1a to the electrode 3a, penetrating through the lower end of the lead presser 13. |
