| 摘要 |
<p>PURPOSE:To obtain the title device with which the prescribed trimming can be conducted even when the position of the material to be trimmed is deviated on an electronic circuit substrate by a method wherein a recognition device, which recognizes the edge of the material to be trimmed, and a correction device and the like, with which the X-Y correction and the theta-correction between the radiation-starting point and the material to be trimmed, are provided. CONSTITUTION:In a trimming device equipped with a table 8 with which an electron circuit substrate 1, having the material 2 to be trimmed, will be moved to X-Y direction, and laser beam radiation devices 14 and 15 with which a laser beam 13 is made to strike the material 2 to be trimmed of the electronic circuit substrate 1 located on the above-mentioned table 8, a recognition device 16, with which the edge of the material 2 to be trimmed will be recognized, and a correcting device 17, with which the X-Y correction between an radiation starting point and the material 2 to be trimmed and the theta-correction between the radiation moving direction and the prescribed trimming direction, are provided on the above-mentioned trimming device. For example, the above-mentioned material 2 to be trimmed is a chip resistor 2 installed on the electronic circuit substrate 1, and the correcting device 17 is a controller 17 which drives the motors 9 to 11, to be used to move the table 8, through the intermediary of a driver 12.</p> |
