| 摘要 |
PURPOSE:To enable a sealing resin to be easily miniaturized in outer shape and to sharply improve a semiconductor device in noise-resistant properties by a method wherein an insulating layer is provided to a part of a lead, and a conductive layer is formed thereon. CONSTITUTION:A semiconductor element 1 is mounted on a semiconductor element mount 4, terminals 5 are connected to a conductive layer 8 and an exposed part 9 of a lead 2 with wires 6 or only to the leads 2, and the semiconductor element 1 is sealed up with a sealing resin 3. An insulating layer 7 is partially provided to the three leads out of the six leads 2, and a conductive layer 8 is formed thereon.
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