发明名称 MANUFACTURE OF CHIP CAPACITOR
摘要 PURPOSE:To simplify the process of producing a chip capacitor for enhancing its productivity by housing the main body 11 of the capacitor in a case and by applying electromagnetic heating to the main body 11 via electrically conductive elastic material 15 installed between an external electrode and a connecting terminal. CONSTITUTION:In a case 13 forming connecting terminals 14 the main body 11 of a capacitor forming external electrodes 12 is housed. In the gap between the outer walls of electrodes 12 of the main body 11 and the outer walls of connecting terminals 14, electrically conductive elastic material 15 is installed. The elastic material 15 contains iron and nickel, and when the capacitor is heated by electromagnetic induction, the elastic materials 15 generate heat Sn-Pb on the surface of external electrodes 12 and that of connecting terminals 14 melts to electrically connect elastic material 15 with electrodes 12 and terminals 14. In the case 13, filling resin 16 is injected to seal the main body 11 of the capacitor.
申请公布号 JPH0456120(A) 申请公布日期 1992.02.24
申请号 JP19900163397 申请日期 1990.06.21
申请人 MURATA MFG CO LTD 发明人 WAKINO KIKUO
分类号 H05B6/02;H01G4/236;H01G4/30;H01G13/00 主分类号 H05B6/02
代理机构 代理人
主权项
地址