发明名称
摘要 PURPOSE:To reduce variations of pattern dimensions extending over the whole area of an exposure surface of a thin plate base material, and to obtain a pattern having uniform dimension, even in case when the surface of the thin plate base material is inclined or the surface is uneven, by slightly vibrating at least one part of a projection optical system, when executing a projection exposure of a projection aligner, etc. CONSTITUTION:A projection optical system 3 for exposing a pattern of a mask 1 onto a wafer 2 consists of an illumination part 8 having a halogen lamp 4, a reflector 5, an aperture 6 and a condenser lens 7, and an image formation part 10 having an image formation lens 9 for reduction, illiminates the mask 1 in the illumination part 8, and after that, forms a mask image on the surface of the wafer 2 in the image formation part 10. Also, it is constituted so that the wafer is slightly vibrated in the upper and lower directions, that is to say, in the optical axis direction by attaching a vibration source 12 to a wafer supporting base 11 on which the wafer 2 has been placed. As for this vibration source 12, a well-known vibromotive machine such as an electromagnetic type, a mechanical type, etc. can be adopted.
申请公布号 JPH0410209(B2) 申请公布日期 1992.02.24
申请号 JP19810115088 申请日期 1981.07.24
申请人 发明人
分类号 H01L21/027;G03F7/20;G03F9/00;G03G15/04;H01L21/30 主分类号 H01L21/027
代理机构 代理人
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