| 摘要 |
PURPOSE:To simplify the manufacturing process of a light emitting device without performing any three-dimensional wiring for connecting a light emitting element on the upper surface of the device to terminals on the lower surface of the device. CONSTITUTION:A pair of conductive resin bodies 24 and 25 and an insulating resin body 26 which is interposed between the bodies 24 and 25 are integrally molded (in two colors) as a package 21 by using a metallic mold and the electrical connection between a light emitting element 22 on the surface of the package 21 and terminals 28 and 32 on the lower surface of the package 1 is secured by means of the resin bodies 24 and 25. Therefore, it becomes unnecessary to form three-dimensional wiring through the through hole, etc., of the package 21. |
