TESTING METHOD OF INTEGRATED CIRCUIT CHIP

摘要

PURPOSE: To provide simulated site test and actual site test for integrated circuit chip by providing a contact corresponding to the contact of semiconductor chip and defining the contact of carrier as a chip carrier having a dendrite surface. CONSTITUTION: A semiconductor circuit chip is placed on a board or a test jig while facing a connector on the board. The board or jig has the dendrite in structure including a conductive pad or substrate, smooth Pd lower layer and upper layer such as a pole-shaped Pd layer on the connecting plane, contact or pad of chip. Then, the chip and the board are contacted and compressing force is applied to the chip and the board. Afterwards, various logic tests and memory tests are performed to the integrated circuit chip while applying power between the input and the ground, and unsuccessful chip is discarded but the successful chip is bonded to the board between the bonding pad and the dendritic surface.