| 摘要 |
PURPOSE:To prevent a soldering defect by opening a nozzle in the direction orthogonal with the direction where objects to be soldered progress, freely rotatably providing an endless body in the direction orthogonal with the direction where the objects to be soldered progress in the form of closing this aperture and providing solder ejection holes over the entire length of this endless body. CONSTITUTION:The nozzle 12 and a pump mechanism 15 which pressurizes and supplies the molten solder 13 in a tank body 11 to the nozzle 12 through a duct 14 are provided in this tank body 11. The endless body 23 is freely turnably provided in the direction orthogonal with the direction where the objects to be soldered progress in the form of closing the aperture 22 of the nozzle 12. The ejection holes 26 provided over the entire length of the endless body 23 move without stopping even momentarily when this endless body 23 is turned. The molten solder 31 ejected from these ejection holes 26 moves at all times in the direction orthogonal with the direction A where the objects to be soldered progress. Gases are expelled from the recessed surfaces in the lower parts of the objects 32 to be soldered by the moving wave 31 thereof, by which the soldering defect by the stagnation of the gases is prevented. |
