发明名称 GLASS CERAMIC MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To disperse a residual stress of an organic resin layer to be concentrated at the end of a board and to prevent peeling of an organic resin layer from the board or crack of a glass ceramic board due to a stress by forming a groove on the periphery of the surface of the board, and forming a structure having the end of the layer to be laminated therein. CONSTITUTION:A groove 12 is fanned on the periphery of a laminated surface of a GCS 11. The end of a polyimide layer 13 of organic resin to be laminated on a board is formed in a structure to be matched to the outer periphery of the groove. The groove 12 is formed at the time point of a green sheet laminate before normal baking. It is because its processing is easy at the time point of the laminate, but the groove might be deviated from a desired position due to difference of contraction rates of laminates after baking. Accordingly, if an accurate groove is formed, it may be formed after baking. The groove is formed under a boundary of the layer 13 to increase the contact area of the layer 13 with the GCS 11, thereby increasing the close contact strength therebetween.
申请公布号 JPH0453191(A) 申请公布日期 1992.02.20
申请号 JP19900159151 申请日期 1990.06.18
申请人 NEC CORP 发明人 ISHIDA HISASHI
分类号 H05K3/46 主分类号 H05K3/46
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