| 摘要 |
<p>A circuit component (100 or 200) comprising typically of a hollow body (101 or 201) and a plurality of solderable terminations (102 and 103) or (202 and 203) is being disclosed. Internal to said circuit component (100 or 200) is a plurality of electrodes (104 and 106) or (204 and 206). A filling point (108, 208) is provided so as to fill the volume of said circuit component (100 or 200) with a specific compound (114 or 214) having a desired electrical characteristic including dielectric constant. A method for manufacturing said circuit component (100 or 200) is disclosed.</p> |
