| 摘要 |
<p>PURPOSE:To decrease a power supply, ground noise and make miniaturization possible by connecting a capacitor module board to a lead side on a side opposite to the side on which the lead contacts. CONSTITUTION:A power-supply conductor 9 and a ground conductor 10 are formed on the surface of an alumina substrate 5. A chip capacitor 7 is connected to the conductors 9, 10 by solder 6. A power-supply through hole 11 and a ground through hole 12 are opened, and a power-supply conductor 13 and a ground conductor 14 are disposed on the rear side of the substrate 5 through the through holes. A bump 4 of Ag paste is formed on the conductors 13, 14. The capacitor module 8 is connected to the side opposite to the side of a TAB lead 2 to which an IC chip 1 is connected by the bump 3. The connection is performed by hardening a bump 4 of the module 8. The distance from a connection point of a decoupling capacitor, the power supply and the gate wire to the IC chip is quite short, and parasitic inductance is quite decreased, thereby decreasing noise.</p> |
