Poly(arcyl ether benzimidazoles) and their use as capping layers in microelectronic structures
摘要
<p>A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.</p>
申请公布号
EP0690498(A2)
申请公布日期
1996.01.03
申请号
EP19950108250
申请日期
1995.05.30
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
AHN, KIE YEUNG;HEDRICK, JAMES LUPTON, JR.;LABADIE, JEFFREY WILLIAM;LEE, KANG WOOK;TWIEG, ROBERT JAMES;VIEHBECK, ALFRED;WALKER, GEORG FREDERICK
