| 摘要 |
PURPOSE:To secure the condition of fixing the lead of a semiconductor device by moving the presser foot at the lead side in agreement with the wiring direction and by pressing only a lead to be bonded. CONSTITUTION:When wiring starts, a change-direction rotary member 5 turns and a capillary 2 moves to a bonding position at the lead side. When the capillary 2 reaches the bonding position at the lead side and starts to lower, a driving cylinder 4 acts to lower a presser pallet 3 to press the neighborhood of the bonding position for a lead 11. At the same time when the capillary 2 that completed bonding at the lead side moves up, the presser pallet 3 is lifted, thereby turning the change-direction rotary member 5 to indicate the next bonding position at the lead side. The bonder calculates a wiring direction to determine a stop position for the change-direction rotary member 5. In this way, only individual leads on which bonding is to be executed can be pressed, leads can be fixed perfectly, thereby being able to promise bonding stability. |
