| 摘要 |
<p>PURPOSE:To efficiently allocate chip regions on a substrate and take chips as much as possible from one substrate by reducing the excess region from which chips are cut. CONSTITUTION:Step-and-repeat is done in such a way that a left end line 108 on inside of an excess region 103 overlap a right end line 105 during exposure by a stepper. As a result, a street line width transferred onto a semiconductor substrate is 100mum. This fact indicates that much integrated circuit pattern regions 203 can be transferred onto a substrate. The arrangement of chips housed substantially falls within an outside circle 204. Chips which have not been formed into perfectly shaped chips on a substrate hitherto are formed into perfectly shaped chips. The chips occur on the upper, lower, right and left of a substrate. The number thereof is always four or more. An increase in the number of effective chips causes the yield to be increased. The size of chips can be determined at will on the basis of the step size during the design of reticules or photoexposure without considering various limitations during the initial period of the design.</p> |
