METHOD FOR BONDING CUBIC BORON NITRIDE SINTERED COMPACT

摘要

A method for bonding a cubic boron nitride sintered compact (1) to other cubic boron nitride sintered compact or to a body of shank material (2) is disclosed. The method comprises forming a Ti layer of 0.01-1 mu m in thickness over a bonding interface between two cubic boron nitride sintered compacts or between a cubic boron nitride sintered compact and a body of shank material, forming a layer of Ni or Cu over the Ti layer to a thickness of 0.01-5 mu m putting together the two cubic boron nitride sintered compacts or the cubic boron nitride sintered compact and the body of shank material with a 10-1,000 mu m foil of Al, Al-Ni alloy or Ag-Cu-In alloy being placed over the boding interface, and heating the cubic boron nitride sintered compact structure to temperatures above the meeting point of the metal foil and not exceeding 750 DEG C in an inert atmosphere or in a vacuum.