发明名称 CONDUCTIVE RESIN MATERIAL AND PREPARATION THEREOF
摘要 PURPOSE:To prepare the subject material having excellent electric conductivity and useful as an electromagnetic shield material, etc., by bonding the powder of a metal to the powder of a resin in a thin filmy state with a high shear force, etc., and further bonding the powder of an electric conductive material to the resin powder with a high shear force, etc. CONSTITUTION:The powder of a resin (e.g. an acrylic resin; preferably a particle of 8-20mum) is mixed with the powder of a metal having good malleability or ductility (e.g. Ag, Al; preferably a particle diameter of <=0.2mum) with a high shear force or high pressure force to bond metal pieces to the surface of the resin powder in a filmy state. The powder of an electro-conductive material such as a metal, carbon or titanium dioxide coated with a metal such as silver is further bonded to the resin powder with a high shear force of high compression force to prepare the objective material. The mixing wt. ratio of the resin powder with the powder of the metal or conductive material is preferably 75-60/25-40.
申请公布号 JPH0450235(A) 申请公布日期 1992.02.19
申请号 JP19900158397 申请日期 1990.06.15
申请人 MITA IND CO LTD 发明人 AZUMA MIKIO
分类号 C08J3/12;C08J3/20;C08K3/02;C08L33/10;C08L101/00 主分类号 C08J3/12
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