| 摘要 |
PURPOSE:To obtain the photosensitive resin composition capable of forming a phosphorescent resist, the photosensitive film and a printed circuit board both using the composition by incorporating a phosphorescent compound. CONSTITUTION:The photosensitive resin composition comprises of a nongaseous ethylenically unsaturated compound having at least 2 C=C double bonds polymerizable by irradiation with active rays, a photopolymerization initiator and/or its derivative to be activated by irradiation with the active rays, a thermoplastic resin binder, a phosphorescent compound, and an organic halogen compound, thus permitting the photosensitive resin composition capable of forming a phosphorescent resist, the photosensitive film and the printed circuit board both using it to be obtained. |
