| 摘要 |
PURPOSE:To obtain the positive type resist which has all of a sensitivity, resolving power, heat resistance, and adhesive property in combination by adding a phenolic compd. having a specific structure to the resist compsn. CONSTITUTION:The alkaline soluble resin contg. the phenolic compd. expressed by formula I and the radiation sensitive component are incorporated into this compsn. In the formula I, R denotes a hydrogen atom, lower alkyl group or phenyl group; R' denotes an alkyl group or alkoxyl group; (n) denotes 0 or >=3 integer. R' is particularly preferably 1 to 5C alkyl group, methoxy group, ethoxy group. The positive type resist which is excellent in the sensitivity, resolving power, heat resistance, and adhesive property is obtd. in this way. |
