| 摘要 |
PURPOSE:To provide the reliance on inter-terminal connections, enhance the bond strength, and increase the electric resistance by furnishing a number of small through holes in a heat resistant resin tape, and embedding in the through holes a binder containing flux components and solder particles included in the binder. CONSTITUTION:A number of small through holes 12 as penetrating in any way are furnished regardless of the bond terminal position for joining with a heat resistant resin tape 1 such as polyimide film, while low melting point solder particles 3 as electroconductive particulates are included in an insulative flux binder 4 containing flux components. and this flux binder 4 is embedded in the through holes 2 in the resin tape 1. This embedment is conducted through a printing process consisting of kneading the solder particles 3 and flux binder 4 together to form a binding agent, placing it upon the resin tape 1 on a working table 6, and moving a squeegee 5 in the A-direction. |
