Positive type photoresist composition.

摘要

A positive type photoresist composition contains (a) 100 parts by weight of a resin which is a polymer compound (A) including carbon-carbon double bonds and having a molecular weight of 300 to 30,000 and an iodine value of 50 to 500. To at least a part of the double bonds of the polymer compound (A), a group represented by the formula (I) is introduced <CHEM> wherein R<1> denotes a hydrogen atom, a halogen atom or an alkyl group having 1 to 3 carbon atoms and R<2> denotes an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group or an aryl group. The composition further contains (b) 25 to 100 parts by weight of a compound containing a quinone diazide unit.