| 摘要 |
<p>PURPOSE:To reduce a heat sink and to enhance a mounting density by installing the sinks on the upper and lower surfaces of a TAB semiconductor device to be mounted on a wiring board, and efficiently dissipating heat generated from a TAB-IC to the atmosphere. CONSTITUTION:A TAB-IC 1 is adhered to a block 2 formed in a heat sink shape with an adhesive 3 having high thermal conductivity. Leads 4 of the TAB-IC 1 bent in an L shape to be able to absorb a force such as a thermal stress, etc., are connected to the connecting pads 6 of a wiring board 5 by soldering, etc. A heat sink 7 is adhered to the circuit surface of the TAB-IC 1 with an insulating adhesive 8 having high thermal conductivity, and the TAB-IC 1 and the connecting part of the TAB-IC 2 to the leads 4 are protected. Heat generated from the TAB-IC 2 is transferred to the sink 7 through the adhesive 8 to be efficiently dissipated to the atmosphere, and simultaneously transferred to the lower block 2 through the adhesive 3.</p> |
