| 摘要 |
PURPOSE:To remove trouble such that scattering occurs in the heights of bumps, and that the tail which becomes the main cause of connection inferiority remains at the cut part of the bump by making it contain a specified percentage of Si and the rest Al and unavoidable impurities. CONSTITUTION:Since mechanical strength improves by making Al alloy for bump contain 0.1-2wt.% Si, the Al alloy can be elongated easily into a fine wire 50mum or less in diameter. Next, by lowering a tool 2 and loading supersonics to a wire 1 through the tool 2 by the supersonic oscillation source provided in the tool 2, while pressing the part in the longitudinal direction at the top end 1a of a wire by the bottom of the tool 2 against the top of the Al electrode 4 of an Si chip 3 at a room temperature, the top end 1a of the wire 1 is joined with the Al electrode 4. The wire 1 is cut halfway, leaving the junction (top end) 1a on the electrode 4, thus a bump 5 is formed at the Al electrode 4. |
