| 摘要 |
PURPOSE:To bring the value of characteristic impedance of a bonding wire into coincidence with that of a signal line by disposing a constant potential metallized part near the wire for electrically connecting a semiconductor chip in an IC package to the line. CONSTITUTION:Since a GND metallized part 11a is disposed near a bonding wire 9 in an IC package 1 and an insulator 14 is interposed therebetween, the thickness of the insulator 14 (i.e., a distance between the part 11a and the wire 9) and the material i.e., relative permittivity) of the insulator 14 are suitably selected to bring the value of characteristic impedance of the wire 9 into coincidence with the value (50OMEGA) of the characteristic impedance of a signal line 7. Thus, since reflection of a signal, a waveform distortion in the package 1 are avoided, a high frequency signal can be transmitted without loss. |
