发明名称 |
Solder interconnection structure and process for making |
摘要 |
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions. |
申请公布号 |
US5089440(A) |
申请公布日期 |
1992.02.18 |
申请号 |
US19900624973 |
申请日期 |
1990.12.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHRISTIE, FREDERICK R.;PAPATHOMAS, KOSTAS I.;WANG, DAVID W. |
分类号 |
H01L21/56;H01L21/60;H01L23/29;H05K3/28;H05K3/34 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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