发明名称 MOUNTING METHOD FOR MULTISTAGE BOARD
摘要 PURPOSE:To facilitate inserting and extracting each of parallel boards and to make also electric connection between complicated boards by making a connection between respective boards using the board for making such structure that the board may be set in a position vertical to each of the multistage boards and may connect the multistage boards in the shape of pi, and then mounting an L-shaped connector on each of the parallel boards while mounting straight type connectors on the vertical board to make the connection between the respective boards. CONSTITUTION:Parallel boards 1 and a vertical board 2 are connected respectively in the shape of pi by L-shaped connectors 3 and straight type connectors 4, and each of the parallel boards 1 can be moved in its right and left directions so as to be inserted into, extracted from and connected to the vertical board 2 without difficulty. The vertical board 2 is fixedly mounted onto the bottom portion of a fixing and protecting frame, and the parallel boards are respectively connected to the vertical board 2 and thereafter fixedly mounted respectively onto guide portions arranged on the side face of the frame righted along each of the parallel boards 1 from the bottom portion of the frame via small screws so that many printed circuit boards can be strongly held.
申请公布号 JPH0447688(A) 申请公布日期 1992.02.17
申请号 JP19900154469 申请日期 1990.06.13
申请人 KONICA CORP 发明人 SOUMA TAKATAMI
分类号 H01R12/16 主分类号 H01R12/16
代理机构 代理人
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