| 摘要 |
PURPOSE:To obtain the title composition improved in impregnability into reinforcing fiber, tack in working and improved in the heat resistance of a cured product by using a bisphenol A diglycidyl ether epoxy resin having a specified molecular weight distribution as a resin composition. CONSTITUTION:An epoxy resin composition containing a bisphenol A diglycidyl ether epoxy resin having such a distribution that the contents of components on the low-molecular side in which n=0, n=1 and n=2 in formula I are 30-85, 5-14 and 1-12wt.%, respectively, wherein the number-average molecular weight of this epoxy resin composition is 500-1,200, the epoxy equivalent is 180-270, and a curing agent is contained. The above composition may optionally contain another epoxy resin so far as the above requirements are satisfied. |
