| 摘要 |
PURPOSE:To facilitate the assembly and inspection of a face mounting type hybrid integrated circuit, and also to improve the lead-forming accuracy of an in-process hybrid IC by bending each of externally drawing leads joined respectively to two side-end portions of a hybrid integrated circuit substrate in its horizontal direction to form a forming fixed-portion, and subsequently bending the forming fixed-portion in its vertical direction. CONSTITUTION:Such a length of each of leads 4 as being able to be fixed without difficulty by each of dies 8, 9, 10 is secured to form a forming fixed-portion 5 in bending back each of the leads 4 from a part bent in a U-shape at the lower portion of a substrate 1 and accordingly drawing out the bent part of the lead 4 to the external side of the substrate 1 in parallel to the part-mounted face of the substrate 1 so as to form the drawn lead. This forming fixed-portion 5 is formed in its horizontal direction near an external electrode terminal 7. Then the lead 4 is bent vertically at the external side of the forming fixed-portion 5 to obtain a hybrid integrated circuit. The hybrid integrated circuit is first received in the die 8, and subsequently the forming fixed-portion 5 of the lead 4 is fixed. Then the die 10 is engaged with the external side of the die 9, and the head 6 of the lead 4 is accordingly pressed by the head 10a of the die 10 so that the head 6 of the lead 4 is formed in an L shape by the head 8b of the die 8 together with the head 10a to manufacture a face mounting type hybrid integrated circuit. |
