发明名称 REFLOW SOLDERING METHOD AND DEVICE
摘要 PURPOSE:To perform satisfactory reflow soldering by surrounding a part from a motor of a blower for circulating inert gas and its rotation axis to an inert gas chamber by a shielding case and cooling the inert gas therein. CONSTITUTION:The inert gas is heated by a heater 2 and circulated in the inert gas chamber 3 and a substrate 11 is heated and subjected to reflow soldering. The whole part extending from the motor 5 to drive the blower 4 circulating the inert gas and this rotation axis 5a to the inert gas chamber 3 is then surrounded by the shielding case 6 and cut off from the outside air. The inside of the shielding case 6 is then filled up with the inert gas and the inert gas in the shielding case is cooled by using a refrigerating machine 9 and the blower 8. Consequently, the consumption of the inert gas can be reduced and the running cost can be reduced.
申请公布号 JPH0446666(A) 申请公布日期 1992.02.17
申请号 JP19900143938 申请日期 1990.05.31
申请人 EITEITSUKU TEKUTORON KK 发明人 YOKOTA YATSUHARU
分类号 B23K1/008;B23K31/02;B23K101/42;H05K3/34 主分类号 B23K1/008
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