| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesive strength between a die pad and die bond material for element fixing, by forming fine irregularities on at least the surface and the backside of a die pad, out of the die pad and inner leads. SOLUTION: Fine irregularities 1a are formed on the surface and the backside of a die pad 1 positioned in the central part of a resin sealing region, and them the surface an the backside of the die pad 1 are kept irregular. In the later die bonding process, die bond material 7 is applied on the surface of the die pad 1, and a semiconductor device 6 is mounted on the material 7 and fixed on the die pad 1. In a resin sealing process, the die pad 1, inner leads 2 and the semiconductor device 6 are integrally sealed in a unified body by using mold resin. In both of the processes, since the fine irregularities are formed on the surface and the backside of the die pad 1 by a roughening process, excellent adhesive strength can be obtained by the increase of adhering area to the die pad 1 and the anchor effect due to the fine irregularities. |
