| 摘要 |
An epoxy resin composition is obtained by mixing (methy) hexahydro phthalic anhydride as a curing agent and diaza- bicyclo alkenes or its salts as a curing accelerator with a main component. The main component is composed of 50-75 wt.% bisphenol-A epoxy resin (1) of 200-250 epoxy equivalent, 5-15 wt.% bisphenol-A (2), 15-35 wt.% alicyclic epoxy resin (3), and 5-20 wt.% dibutyl phthalate (4). The resin (3) is 3,4-cyclohexylmethyl (3,4-epoxy)cyclohexyl carboxilate. The resin composition has a good heat resistance and a low internal stress, and used for the light-emitting elements.
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