| 摘要 |
<p>PURPOSE:To store a large-sized semiconductor chip so as to make it into a superthin package by fixing a lead to the circuit formation face through an insulating adhesive layer, and sealing only the circuit formation face of a chip or the side with resin. CONSTITUTION:A lead 3 is fixed through an insulating adhesive film 2 to the circuit formation part of a semiconductor chip 1, and the lead 3 and the outer terminal of the chip 1 are bonded to each other by a fine metallic wire 5. The circuit formation face of the chip 1 is sealed by potting method with liquid-form resin 6 such as epoxy resin, or the like. Then, the outer lead of the lead 3 is bent. Since the sealing resin does not exist on the side of the chip 1, or, even if it exists, it is such a thin layer at the level that it flows during resin bonding, it can be made into a package approximately same in dimension as the chip 2, and since there is no resin on the rear of the chip 1, the thickness of the package can be made thin. Heat radiation efficiency can be improved by bonding a heat radiating fin 9 to the rear of the chip 1 with a thermally conductive adhesive 10.</p> |
