| 摘要 |
PURPOSE:To realize highly dense mounting and speed up without being influenced by noise by constituting it such that it has a planar large area of lead for power supply at the part on which a semiconductor chip is mounted. CONSTITUTION:A chip 2 is mounted on a lead 1a for power supply, and at the upper and lower ends (short sides) are arranged many bonding pads, for example, a pad 3 for an input buffer circuit, a pad 4 for a common source driving circuit, a pad 5 for a main amplifying circuit, pads 6 and 7 for data output circuits, pads 8 and 9 for input buffer circuits, a pad 10 for a Y system addressing circuit, and a pad 11 for an X system addressing circuit. As a result of the lead 1a for power supply with large area being secured at the part for mounting a chip 2, the power wiring of low resistance, low inductance, and high capacity can be gotten, and it never causes voltage fluctuation. Accordingly, it never causes noise, nor incur malfunction, etc. What it more, by having provided the lead 1a for power supply, the wiring for power supply inside the chip 2 can be remarkably reduced. |
