| 摘要 |
An epoxy resin composition for sealing a semiconductor comprises 10-30 wt. pts.of epoxy resin (1), 5-20 wt. pts. of novolak resin (2), 60-80 wt. pts. of inorganic filler (3), 0.01-5 wt. pts. of organic phosphine compound (4), 0.01-10 wt. pts. of sulfur compound (5) and 0.01-5 wt. pts. of S-triazine (6) containing at least one of amine group. The resin (1) is pref. bisphenol-A epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, glycidyleter epoxy resin and/or alicyclic epoxy resin. The resin composition has a good adhesion to metal and antifouling of mold.
|
