| 摘要 |
<p>PURPOSE:To enlarge the degree of freedom by covering the region between the bed part and the outer leads, inclusive of the inner ends of the outer leads and the periphery of the bed part, with a nonconductive film-shaped member. CONSTITUTION:This comprises a plate-shaped bed part 10, a semiconductor element 14, which is fixed to the plate-shaped bed part and on which pads 17 are made, a lead part 11 (outer leads), which is arranged around the bed part, and a nonconductive film-shaped member 13, which is installed to cover the region between the bed part and the lead part inclusive of the periphery of the bed part and the inner end of the lead part. And the semiconductor element 14 and the outer leads 11 are connected by fine metallic lines 18, and those are molded with sealing resin, and as a result, it becomes such a shape that only the outer leads are led out of the resin layer. So, an always stable loop shape can be gotten, since it is not influenced by the angles of entry of the fine metallic lines to the leads, and the degree of freedom in design becomes high.</p> |
