发明名称 MOLDING RESIN COMPOSITION
摘要 PURPOSE:To obtain the subject molding resin composition having excellent mechanical strength, heat-resistance and moldability by uniformly mixing a polyamide resin, a thermoplastic polyester resin, a specific modified polyoctenamer and optionally glass fiber. CONSTITUTION:The objective composition is composed of (A) 70-99.5% of a resin mixture consisting of (a) 5-95wt.% of a polyamide resin (preferably nylon 6, nylon 12, etc.) and (b) 95-5wt.% of a thermoplastic polyester resin (preferably polyethylene terephthalate or polybutylene terephthalate) and (B) 0.5-30wt.% of a modified polyoctenamer produced by polymerizing 19-1wt.% of an alpha,beta-unsaturated carboxylic acid compound and 19-1wt.% of an unsaturated epoxy compound in the presence of 80-98wt.% of a polyoctenamer and having a number- average molecular weight of preferably 50,000-200,000. As necessary, 50-90wt.% of the above composition is compounded with 50-10wt.% of glass fiber.
申请公布号 JPH0445153(A) 申请公布日期 1992.02.14
申请号 JP19900152967 申请日期 1990.06.12
申请人 DAICEL CHEM IND LTD 发明人 WATANABE ICHIJI;SUMIDA KATSUHIKO
分类号 C08K7/14;C08L33/02;C08L33/04;C08L35/00;C08L37/00;C08L67/00;C08L67/02;C08L77/00 主分类号 C08K7/14
代理机构 代理人
主权项
地址