发明名称 Method of manufacturing a wiring layer in a semiconductor device
摘要 In a method of building up wiring with a protective insulator film as a mask, a precise and elaborate wiring pattern is formed. The method comprises a process of making up a conductive material film on the surface of a semiconductor substrate, a process of depositing a inorganic insulator film consisting of a semiconductor oxide film and a semiconductor nitride film in layers on the conductive material film, a process of making up an antireflection film for an irradiation light for sensitizing used in photo lithography which patterns photosensitivity resist film, a process of making up the photosensitivity resist film on the antireflection film to pattern in a predetermined shape, and a process of applying dry etching to the conductive material film and the antireflection film with the inorganic insulator film as a mask.
申请公布号 US5846878(A) 申请公布日期 1998.12.08
申请号 US19970808529 申请日期 1997.02.28
申请人 NEC CORPORATION 发明人 HORIBA, SHINICHI
分类号 H01L21/027;H01L21/28;H01L21/3213;H01L21/768;(IPC1-7):H01L21/476 主分类号 H01L21/027
代理机构 代理人
主权项
地址
您可能感兴趣的专利