发明名称 |
THERMALLY CURABLE ORGANOPOLYSILOXANE COMPOSITION |
摘要 |
PURPOSE:To improve the storage stability at around room temp. and adhesion to various substrate materials by compounding three specific organopolysiloxanes and a particulate thermoplastic resin catalyst contg. a hydrosilylation catalyst. CONSTITUTION:A thermoplastic resin having a softening point of 50-200 deg.C is compounded with 0.01wt.% or higher hydrosilylation catalyst pref. comprising a platinum catalyst to give a particulate thermoplastic resin catalyst having a mean particle diameter of 0.01-100mum and contg. the hydrosilylation catalyst. 100 pts.wt. organopolysiloxane of the formula [wherein R is a (substd.) monovalent hydrocarbon group; and (a) is 1.0-2.3] having at least two alkenyl groups directly bound to an Si atom in the molecule, 0.1-20 pts.wt. organopolysiloxane having at least one epoxidized org. group and at least three hydrogen atoms directly bound to an Si atom in the molecule, 0-20 pts.wt. organopolysiloxane having at least one alkoxysilyl group and at least three hydrogen atoms directly bound to an Si atom, and 0.005-100 pts.wt. said particulate thermoplastic resin catalyst are compounded. |
申请公布号 |
JPH0441562(A) |
申请公布日期 |
1992.02.12 |
申请号 |
JP19900151152 |
申请日期 |
1990.06.08 |
申请人 |
TORAY DOW CORNING SILICONE CO LTD |
发明人 |
TOGASHI ATSUSHI;KASUYA AKIRA |
分类号 |
C08K9/10;C08L83/04;C08L83/07 |
主分类号 |
C08K9/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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