发明名称 THERMALLY CURABLE ORGANOPOLYSILOXANE COMPOSITION
摘要 PURPOSE:To improve the storage stability at around room temp. and adhesion to various substrate materials by compounding three specific organopolysiloxanes and a particulate thermoplastic resin catalyst contg. a hydrosilylation catalyst. CONSTITUTION:A thermoplastic resin having a softening point of 50-200 deg.C is compounded with 0.01wt.% or higher hydrosilylation catalyst pref. comprising a platinum catalyst to give a particulate thermoplastic resin catalyst having a mean particle diameter of 0.01-100mum and contg. the hydrosilylation catalyst. 100 pts.wt. organopolysiloxane of the formula [wherein R is a (substd.) monovalent hydrocarbon group; and (a) is 1.0-2.3] having at least two alkenyl groups directly bound to an Si atom in the molecule, 0.1-20 pts.wt. organopolysiloxane having at least one epoxidized org. group and at least three hydrogen atoms directly bound to an Si atom in the molecule, 0-20 pts.wt. organopolysiloxane having at least one alkoxysilyl group and at least three hydrogen atoms directly bound to an Si atom, and 0.005-100 pts.wt. said particulate thermoplastic resin catalyst are compounded.
申请公布号 JPH0441562(A) 申请公布日期 1992.02.12
申请号 JP19900151152 申请日期 1990.06.08
申请人 TORAY DOW CORNING SILICONE CO LTD 发明人 TOGASHI ATSUSHI;KASUYA AKIRA
分类号 C08K9/10;C08L83/04;C08L83/07 主分类号 C08K9/10
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