Release composition

摘要

A composition of matter comprising: (a) about 60 to about 99 parts by weight of a curable epoxypolyorganosiloxane; (b) about 1 to about 40 parts by weight of a crosslinkable silicone hydride resin having no epoxy functionality; and (c) about 0.1 to about 5 parts by weight of an curing agent, which, upon exposure to actinic radiation is capable of curing components (a) and (b); wherein the total amount of components (a) and (b) is 100 parts by weight and wherein said composition demonstrates surface release properties when coated and cured onto a substrate is provided. The composition is particularly useful in articles of manufacture where release properties are desired.