| 摘要 |
In a method for fastening electronic components on a substrate by means of pressure sintering, which includes providing a layer of sinterable metal powder on a surface of one component, assembling the components engaging the layer and then, while exerting a pressure on the components, applying heat to sinter the layer of material, an improvement comprises forming the layer of sinterable metal powder by vaporizing a metal and condensing the metal as a nanocrystalline metal powder on the surface. Preferably, the metal powder is silver and is applied in a precipitation chamber.
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