| 摘要 |
PURPOSE:To prevent occurrence of defective connections caused by the flowing out of solder between an electric component main body and terminals and positional deviation of the main body by providing stepped sections in the internal ends of the terminals and soldering the main body onto the stepped sections of the terminals, and then, covering the terminals and main body with a resin-molded section, leaving parts of the terminals exposed. CONSTITUTION:A lead frame 5 with facing terminal sections 20 protruding inward is obtained by press-forming a recessed section on a band plate 50 and punching the central part and both side sections of the plate 50. An electronic component main body 1 is placed on and soldered to the stepped sections 2a of the terminal sections 20 by applying solder paste to the sections 2a and heating the sections 2a after placing the main body 1. At the time of soldering, no positional deviation of the main body 1 occurs, because the molten solder stays on the sections 2a and does not flow out from the sections 2a. Then a resin molded section 3 which covers the entire surface of the main body 1 and parts of the sections 20 is formed by performing resin molding on the main body 1 and, finally, the terminal sections 20 are cut off along cutting lines c set along the side face. |
