| 摘要 |
PURPOSE:To prevent a drop in heat resistance of polyimide which is often observed and obtain a high reliability multilayer wiring component body by providing a chromate treatment film between a polyimide group insulating film and a metal wiring. CONSTITUTION:A first layer of wiring is formed on a multilayer aluminum ceramic board. Then, the board is submerged in a potassium dichromate solution. After that process is over, there is formed a chromate film formed by the potassium dichromate solution on a metal wiring. A polyimide group insulating film is formed on the board. The insulating film is pattern-processed so as to provide an opening section with an upper part of wiring. Then, a second layer of wiring is formed on the wiring board. The second layer wiring patterns are processed with a potassium dichromate solution and a chromate film is formed on the metal wiring. After the film is formed, a polyimide group insulating film is further formed thereon, thereby forming a chromate treated film. This construction makes it possible to prevent the reaction between polyimide and copper and nickel on the metal wiring definitely and improve the heat resistance of polyimide, and manufacture high reliability multilayer wiring component body in a simple and economical method. |
