发明名称 PACKAGING DESIGN SYSTEM FOR MULTI-PIECE PRINTED BOARD
摘要 PURPOSE:To reduce the amount of data required for the packaging design of a multi-piece printed board by generating one piece of packaging data for the same piece included in the multi-cavity printed board, and executing edit by preparing piece information with respect to each piece. CONSTITUTION:Printed board packaging information 6 can be obtained by using circuit information 5 by a circuit design part 1, performing one packaging design for the same piece on the multi-piece printed board, and generating one piece of packaging data in accordance with different kinds of data. Thence, an editing part 3 performs the edit of the data for multi-piece printed board piece packaging 7 for the kind and number, etc., of the piece provided on a printed board generated in advance by referring to the printed board packaging data 6 for each piece, then, generates multi-piece printed board packaging data 8 for work including the packaging data for work of all the pieces on the printed board. Thereby, it is possible to easily perform the packaging design of the multi-piece printed board, and to reduce the amount of design data.
申请公布号 JPH0440567(A) 申请公布日期 1992.02.10
申请号 JP19900148947 申请日期 1990.06.07
申请人 FUJITSU LTD 发明人 MATSUMOTO HIROSHI
分类号 H05K13/02;G06F17/50;H05K3/00;H05K13/04 主分类号 H05K13/02
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