| 摘要 |
PURPOSE:To improve the responsive property of heating and cooling by a method wherein the mold device in which a heating cooling element is mounted to a surface layer section of a molding surface of a mold and an another system heating cooling device is disposed into the mold is employed, while the resin is heated by means of said heating cooling element before projection and the resin is cooled before and after projection. CONSTITUTION:The mold device for projection molding by this invention is constituted in such a manner that the stratified heating cooling element 3 is mounted to the surface layer section of at least one part of the mold molding surfaces 4aa, 4bb along the molding surface, and the another system heating and/or cooling device is set up into the mold. Said heating cooling element is formed to ensure that a large number of n type semiconductors 31 and p type semiconductors 32 are arranged alternately, connected in series by conductors 33 and held by insulating layer 34. DC currents are conducted so that said stratified heating cooling element 3 heats the molding surface before projecting the resin in a mold cavity 5 and the molding surface is cooled before and after projecting the resin by using the mold device, and a shape is mold-released. |
