| 摘要 |
PURPOSE:To prevent the disconnection of a covered wire, by a method wherein, in a resin seal type semiconductor device using a pellet, leads and covered wires, an aperture is formed around a tab so as to penetrate the tab from the surface to the rear. CONSTITUTION:A single crystal silicon substrate 2A is used as a main body, thereby forming a pellet 2. A system circuit is mounted on the surface of the substrate 2A. A wiring layer is formed on the surface of a substrate 2A so as to interpose an interlayer insulating film 2B. The semiconductor pellet 2 is fixed on the surface of a tab 4A so as to interpose an adhesive layer 3. A flat slit type aperture 4D stretching slenderly along the periphery is formed in the tab 4A. The aperture 4D is constituted as a hole penetrating the tab 4A from the surface side to the rear side, and connects resin 6 on the surface side and the rear side of the tab 4A, on the periphery of the tab 4A. Thereby the movement of resin caused by the temperature cycle of the peripheral part of the tab is reduced, and the stress generated in the covered wire can be decreased. As the result, the disconnection of covered wire can be prevented. |
