| 摘要 |
<p>Disclosed is a connector structure on a substrate (10) which includes at least one first solder portion (16) on the surface of the substrate; at least one second solder portion (18) connected to each of the at least one first solder portions; and an epoxy layer (20) disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.</p> |
