VORRICHTUNG ZUM EINSEITIGEN AETZEN EINER HALBLEITERSCHEIBE

摘要

A device for one-sidedly etching a semiconductor slice (silicium wafer) has a tub-shaped base body (3, 23) upon which is hermetically fitted a lid (2, 22), in the nature of an etching box. The upper side of the lid (2, 22) is provided with an opening (5, 25) through which flows the etching liquid. The etching box bears at least two O-rings seals (7, 8, 27, 28), of which one is centrally arranged in the base body (3, 23) and the other is centrally arranged in the lid (2, 22). A wire (10) of a spring contact (11, 41) connected with the wafer is led out of the etching box through a bore (4) in the base body (3, 23).