ATTACHING INTEGRATED CIRCUITS TO CIRCUIT BOARDS

摘要

A method of connecting an electronic component such as an integrated circuit (10) to a circuit board (24) comprises the steps of depositing solder (20) in a predetermined pattern on contact zones (12) of the electronic component; raising the deposited solder relative to the contact zones; bringing the electronic component and the circuit board into abutment so that the solder pattern on the one and complemental contact zones (26) on the other are aligned; and reflowing the solder to join the component and the board. The deposited solder pattern can be formed by screen printing solder cream onto the contact zones. The solder can be reflowed to create solder bumps (22), or may simply be deposited to the required thickness. Alternatively, the solder pattern can be formed by wave soldering the contact zones, thereby depositing solder bumps (22) on the contact zones. The method can be used for connecting a number of electronic components simultaneously to a multiple circuit board, the multiple circuit board subsequently being cut into separate individual boards.